Patent Number: 8,318,057

Title: Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby

Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Inventors: Harden; Brian (Charlotte, NC), Kathman; Alan (Charlotte, NC), Feldman; Michael (Charlotte, NC)

Assignee: Digitaloptics Corporation East

International Classification: B29D 11/00 (20060101)

Expiration Date: 2021-11-27 0:00:00