Patent Number: 8,318,595

Title: Self-assembled electrical contacts

Abstract: Self-assembling microscale electrical and mechanical connections includes a part binding site and a part electrical binding site; and a template binding site comprising a template electrical conductor layer; a metallization layer on the template electrical conductor layer; a bump structure comprising a solder alloy positioned on the metallization layer, wherein the solder alloy is liquefied to allow the bump structure to self-assemble and align with the part electrical binding site using capillary forces, and wherein the solder alloy only liquefies at a temperature above that at which the self-assembly and alignment is performed; and a fluid on the template electrical conductor layer, wherein the fluid comprises a melting point lower than that of the solder alloy, wherein the fluid binds with the part binding site.

Inventors: Morris; Christopher J. (Silver Spring, MD), Dubey; Mandan (South River, NJ)

Assignee: The United States of America as represented by the Secretary of the Army

International Classification: H01L 21/44 (20060101)

Expiration Date: 2021-11-27 0:00:00