Patent Number: 8,318,610

Title: Method for thin film device with stranded conductor

Abstract: Provided is a thin film device and an associated method of making a thin film device. For example, fabrication of an inverter thin film device is described. Moreover, a parallel spaced electrically conductive strips are provided upon a substrate. A functional material is deposited upon the conductive strips. A 3D structure is then provided upon the functional material, the 3D structure having a plurality of different heights, at least one height defining a first portion of the conductive strips to be bundled. The 3D structure and functional material are then etched to define a TFD disposed above the first portion of the conductive strips. The first portion of the conductive strips is bundled adjacent to the TFD.

Inventors: Mei; Ping (Palo Alto, CA), Luo; Hao (Palo Alto, CA), Taussig; Carl (Palo Alto, CA)

Assignee: Hewlett-Packard Development Company, L.P.

International Classification: H01L 21/31 (20060101)

Expiration Date: 2021-11-27 0:00:00