Patent Number: 8,441,805

Title: Circuit board mounting structure of compound circuit

Abstract: A structure for mounting a compound circuit on a circuit board is provided. The compound circuit includes a high voltage circuit and a low voltage circuit whose supply voltages are different from each other. The structure includes: a main circuit board on which constituents of the low voltage circuit are mounted; and a hybrid IC which includes a sub circuit board on which at least a part of constituents of the high voltage circuit is mounted and a moisture preventing agent coating the sub circuit board, and is arranged over the main circuit board. Both an insulation distance between terminals provided on the main circuit board for connecting to the hybrid IC and an insulation distance between terminals provided on the hybrid IC for connecting to the main circuit board are larger than a minimum insulation distance between terminals provided on the constituents mounted on the sub circuit board.

Inventors: Kawamura; Yoshihiro (Makinohara, JP)

Assignee: Yazaki Corporation

International Classification: H01R 9/00 (20060101)

Expiration Date: 2021-05-14 0:00:00