Patent Number: 8,471,586

Title: Wafer prober for semiconductor inspection and inspection method

Abstract: A wafer prober is provided with a tray which supports a wafer at a set position, transports it to a processing position of the wafer and is placed at the processing position; one or more alignment units which position the wafer at the set position with respect to the tray; contact units arranged in number larger than that of the alignment units and performing inspection processing in contact with the wafer at the processing position; and a tray transport portion for transporting the tray supporting the wafer between the alignment unit and the contact unit. The tray is provided with three or more pin holes for allowing movement of the chuck pin in the XYZ.theta. directions, an alignment mark for positioning the wafer, and an alignment portion for positioning the tray itself.

Inventors: Washio; Kenichi (Tokyo, JP), Yasuta; Katsuo (Tokyo, JP), Sugiyama; Umenori (Tokyo, JP), Masuta; Hikaru (Tokyo, JP)

Assignee: Kabushiki Kaisha Nihon Micronics

International Classification: G01R 31/26 (20060101)

Expiration Date: 2021-06-25 0:00:00