Patent Number: 8,501,045

Title: Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 .mu.m or greater but less than 10 .mu.m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40.degree. C. and a mean coefficient of thermal expansion of 30 to 200 ppm/.degree. C. at from 25.degree. C. to 100.degree. C. when subjected to the curing treatment.

Inventors: Arifuku; Motohiro (Chikusei, JP), Watanabe; Itsuo (Chikusei, JP), Gotou; Yasushi (Chikusei, JP), Kobayashi; Kouji (Chikusei, JP), Kojima; Kazuyoshi (Chikusei, JP)

Assignee: Hitachi Chemical Company, Ltd.

International Classification: H01B 1/22 (20060101); C09J 9/02 (20060101); H01R 11/01 (20060101); H01L 21/60 (20060101); H05K 1/14 (20060101)

Expiration Date: 2021-08-06 0:00:00