Patent Number: 8,507,323

Title: Method of producing semiconductor device with patterned photosensitive adhesive

Abstract: A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.

Inventors: Masuko; Takashi (Ibaraki, JP), Kawamori; Takashi (Ibaraki, JP), Mitsukura; Kazuyuki (Ibaraki, JP), Katogi; Shigeki (Ibaraki, JP)

Assignee: Hitachi Chemical Company, Ltd.

International Classification: H01L 21/44 (20060101); H01L 21/50 (20060101); H01L 21/48 (20060101)

Expiration Date: 2021-08-13 0:00:00