Patent Number: 8,573,814

Title: Object having internal cavities, light emitting diode assembly

Abstract: An object with an internal cavity may serve as a cooling structure for a semiconductor package. The object includes a stack of form fitting bodies. The stack has a first form fitting body shaped according to the cavity with a first layer forming a partially form fitting surface, the first layer including a mixture of a first metal and an oxide of the first metal, and a second layer adjacent to the first layer. The second layer includes the first metal but less oxide of the first metal than the first layer. The stack has a second form fitting body shaped according to the cavity with a first layer forming a partially form fitting surface configured to conform to the partially form fitting surface of the first form fitting body.

Inventors: Traupe; Ulrich (Wiesbaden, DE), Ballacchino; Pellegrino (Wiesbaden, DE), Spandl; Edgar (Hunfelden, DE)

Assignee: Excelitas Technologies GmbH & Co. KG

International Classification: F21V 29/00 (20060101)

Expiration Date: 1/05/12017