Patent Number: 8,574,389

Title: Method of manufacturing thin film device

Abstract: A method of manufacturing a thin film device according to an aspect of the invention may include: preparing a substrate on which a sacrificial layer and a thin film to be transferred are sequentially formed; temporarily bonding the thin film to a circumferential surface of the transfer roll, and simultaneously removing the sacrificial layer to separate the thin film from the substrate at a first position of a transfer roll that is rolling; and transferring the thin film onto a sheet by running the sheet so that a surface of the sheet is bonded to the thin film temporarily bonded to the circumferential surface of the transfer roll. The substrate may be a transparent substrate.

Inventors: Lee; Hwan-Soo (Seoul, KR), Oh; Yongsoo (Seongnam, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: B32B 38/10 (20060101)

Expiration Date: 1/05/12017