Patent Number: 8,574,444

Title: Fabricating method for multilayer printed circuit board

Abstract: A method of fabricating a multilayer printed circuit board includes forming a first circuit-forming pattern and a via-forming pattern on a first carrier, and forming a first insulation layer; repeatedly forming inner circuit patterns and inner insulation layers over the first insulation layer by forming circuit-forming patterns and imprinting, and forming inner vias connecting the inner circuit patterns positioned on different insulation layers; forming a second circuit-forming pattern on a second carrier and inserting the first circuit-forming pattern and the second circuit-forming pattern respectively into the first insulation layer and a second insulation layer; removing the first carrier and the second carrier; forming circuit-forming grooves by removing the first circuit-forming pattern and the second circuit-forming pattern, and forming via-forming indentations connected with the circuit-forming grooves; and forming outer circuit patterns and outer vias by filling the circuit-forming grooves and the via-forming indentations with a conductive material.

Inventors: Watanabe; Ryoichi (Sakai, JP)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: H05K 3/00 (20060101)

Expiration Date: 1/05/12017