Patent Number: 8,574,698

Title: Water-based hot-foam adhesive panel

Abstract: An environmentally friendly water-based heat-expandable adhesive panel, having high adhesiveness and containing solvent-free resins, comprises a substrate layer functioning as a base layer, a primer layer coated on the substrate layer and a heat-expandable layer coated on the primer layer, which is for use in an electronic or plastic component processing process to adhesively fix electronic or plastic components in place temporarily and separate, upon completion of the processing process and commencement of a component-reactivating process, the components from the water-based heat-expandable adhesive panel by heating the water-based heat-expandable adhesive panel at a fixed temperature for a specific period of time, so as to reduce volatile organic compound (VOC) emissions and effectuate environmental protection.

Inventors: Fung; Dein-Run (Taipei, TW), Hsu; Sen-Huang (Taipei, TW), Wu; Hung-Hsun (Taipei, TW), Juang; Huei-Jiun (Taipei, TW)

Assignee: Nan Ya Plastics Corporation

International Classification: B32B 9/00 (20060101); B32B 33/00 (20060101)

Expiration Date: 1/05/12017