Patent Number: 8,574,702

Title: Shell structure and manufacturing method for shell structure of electronic device

Abstract: A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.

Inventors: Wu; Jung-Chin (Taipei, TW), Lin; Po-An (Taipei, TW), Ling; Kuo-Nan (Taipei, TW), Huang; Han-Ching (Taipei, TW), Chiang; Chih-Wen (Taipei, TW), Chang; Chien-Min (Taipei, TW)

Assignee: Compal Electronics, Inc.

International Classification: B32B 3/12 (20060101)

Expiration Date: 1/05/12017