Patent Number: 8,574,996

Title: Method of manufacturing semiconductor device

Abstract: A method of manufacturing a semiconductor device comprises: forming a processing target; forming a first supporter on the processing target; forming a first mask so as to contact one side surface of the first mask with a side surface of the first supporter; patterning the processing target using, as masks, the first mask and the first supporter; forming a second supporter so as to be contacted with a side surface of the processing target exposed in first processing step and the other side surface of the first mask; removing the first supporter; and patterning the processing target using, as masks, the first mask and the second supporter.

Inventors: Kakegawa; Tomoyasu (Tokyo, JP)

Assignee: Elpida Memory, Inc.

International Classification: H01L 21/20 (20060101)

Expiration Date: 1/05/12017