Patent Number: 8,575,248

Title: Polymer composition for microelectronic assembly

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.

Inventors: Apanius; Christopher (Moreland Hills, OH), Bell; Andrew (Lakewood, OH), Langsdorf; Leah (Akron, OH), Tsang; W. C. Peter (Broadview Heights, OH)

Assignee: Promerus, LLC

International Classification: C08K 5/42 (20060101); C08K 5/55 (20060101); B23K 35/36 (20060101); B23K 20/24 (20060101)

Expiration Date: 1/05/12017