Patent Number: 8,575,756

Title: Power package module with low and high power chips and method for fabricating the same

Abstract: Disclosed herein are a power package module and a method for fabricating the same, including: a base substrate; a plurality of high power chips and a plurality of low power chips electrically connected to the base substrate; and a plurality of metal lead plates electrically connecting the plurality of high power chips and the plurality of low power chips to the base substrate.

Inventors: Jang; Bum Sik (Gyunggi-do, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd

International Classification: H01L 23/29 (20060101); H01L 23/31 (20060101); H01L 25/18 (20060101); H01L 25/04 (20060101)

Expiration Date: 1/05/12017