Patent Number: 8,575,954

Title: Structures and processes for fabrication of probe card assemblies with multi-layer interconnect

Abstract: Based upon a layout of a semiconductor wafer comprising a plurality of integrated circuits at pre-defined locations, each integrated circuit comprising a set of electrical connection pads, a probe chip contactor is established, having a unit standard cell on the probe side of the probe chip to correspond to each of the arranged integrated circuits. The unit standard cell is stepped and repeated for the probe side of the probe chip contactor, to establish a wafer scale standard cell layout. The opposite contact side of the probe chip contactor is connectable to a central structure, e.g. a Z-block or PC board, typically comprising a fixed array of vias with fixed X, Y, and Z locations. The routing of contact side of the probe chip contactor is preferably routed automatically, such as implemented on one or more computers, to provide electrical connections between the substrate through vias and the Z-block through vias.

Inventors: Chong; Fu Chiung (Saratoga, CA), Bottoms; William R. (Palo Alto, CA), Chieh; Erh-Kong (Cupertino, CA), Lam; Nim Cho (Saratoga, CA)

Assignee: Advantest (Singapore) Pte Ltd

International Classification: G01R 31/00 (20060101)

Expiration Date: 1/05/12017