Patent Number: 8,577,494

Title: Semiconductor manufacturing apparatus and control system and control method therefor

Abstract: Disclosed herein is technology for, among other things, a semiconductor manufacturing apparatus, and a control system and a control method therefor, by which a target parameter that is measured from a wafer processed with a plurality of processing parameters that are processing conditions of the semiconductor manufacturing apparatus to process a wafer, a multiple classification analysis is performed with the plurality of processing parameters and the target parameter to calculate a model formula expressing the target parameter in a selected parameter, a predicted value of the target parameter of the wafer being processed by use of the model formula is calculated, while the processing is being performed, the processing parameters of the processing is modified on the basis of the predicted value, and the processing is continuously performed.

Inventors: Miwa; Kazuhiro (Fukushima-ken, JP), Watanabe; Kazuhiro (Fukushima-ken, JP), Mifune; Akito (Fukushima-ken, JP)

Assignee: Spansion LLC

International Classification: G06F 19/00 (20110101)

Expiration Date: 1/05/12017