Patent Number: 8,580,375

Title: Soy composite materials comprising a reducing sugar and methods of making the same

Abstract: The present invention provides composite materials derived from formaldehyde-free aqueous binder compositions comprising defatted soy flour of no greater than 43 micron mesh particle size, polymer particles of at least one emulsion (co)polymer, and one or more reducing sugar. Also provided are methods of making and using composite materials containing the formaldehyde-free binder compositions.

Inventors: Kelly; Michael D. (North Wales, PA)

Assignee: Rohm and Haas Company

International Classification: B32B 5/16 (20060101)

Expiration Date: 2022-11-12 0:00:00