Patent Number: 8,584,354

Title: Method for making glass interposer panels

Abstract: Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D.sub.1. A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D.sub.2. A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.

Inventors: Cornejo; Ivan A (Corning, NY), Gomez; Sinue (Corning, NY), Harris; James Micheal (Elmira, NY), Moore; Lisa Anne (Corning, NY), Tsuda; Sergio (Horseheads, NY)

Assignee: Corning Incorporated

International Classification: H05K 3/10 (20060101)

Expiration Date: 1/19/12018