Patent Number: 8,584,859

Title: Cover tape for packaging electronic part and electronic part package

Abstract: The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape (100) relating to the present invention includes a plurality of layers including at least a base layer (110) and a heat seal layer (140). At least two layers of these plurality of layers are laminated with an adhesive layer (120) interposed. The adhesive layer (120) contains an antistatic agent in an amount that makes up 10 wt % or more and 70 wt % or less of the adhesive layer (120). The antistatic agent contains an alkylene carbonate and a surfactant as the primary components.

Inventors: Hiramatsu; Masayuki (Tokyo, JP)

Assignee: Sumitomo Bakelite Co., Ltd

International Classification: B65D 73/02 (20060101)

Expiration Date: 1/19/12018