Patent Number: 8,584,918

Title: Fracturing apparatus

Abstract: A fracturing apparatus is provided. The fracturing apparatus includes a first board portion, a pressing element, a first suction device, a second board portion, a second suction device, and a cylinder. The first suction device is secured to the first board portion. The second board portion is rotatably connected to the first board portion. The second suction device is secured to the second board portion. The pressing element is secured to the first board portion and disposed between the first board portion and the second board portion. The cylinder is located on the first board portion and includes a piston rod rotatably connected to the second board portion. When the piston rod extends, the second board portion is pressed by the piston rod and swiveled about the first board portion.

Inventors: Su; Chih-Chieh (Hsinchu, TW), Tsai; Sheng-Hong (Hsinchu, TW), Huang; Tyng-Bin (Hsinchu, TW)

Assignee: Ritek Corporation

International Classification: B26F 3/00 (20060101)

Expiration Date: 1/19/12018