Patent Number: 8,584,924

Title: Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Inventors: Schulz-Harder; Jurgen (Lauf, DE)

Assignee: Curamik Electronics GmbH

International Classification: B23K 20/24 (20060101)

Expiration Date: 1/19/12018