Patent Number: 8,585,831

Title: Substrate cleaning method

Abstract: There is provided a substrate cleaning method capable of cleaning a substrate on which a fine pattern is being formed in a short time with a simple configuration without having a harmful influence on the fine pattern. In the method, the substrate is transferred from a processing chamber for performing a process on the surface of the substrate therein to a cleaning chamber for cleaning the substrate therein. The substrate is cooled to a temperature in the cleaning chamber. A superfluid is supplied to the surface of the substrate, and contaminant components in the fine pattern are flowed out along with the superfluid as the superfluid flows over from the surface of the substrate.

Inventors: Matsui; Hidefumi (Nirasaki, JP), Moriya; Tsuyoshi (Tokyo, JP), Nishimura; Eiichi (Nirasaki, JP), Kawaguchi; Shinichi (Nirasaki, JP), Yamawaku; Jun (Nirasaki, JP), Miyauchi; Kunio (Nirasaki, JP)

Assignee: Tokyo Electron Limited

International Classification: B08B 3/00 (20060101)

Expiration Date: 1/19/12018