Patent Number: 8,585,875

Title: Substrate plating apparatus with multi-channel field programmable gate array

Abstract: A system for electroplating a substrate includes one or more controllers, with each controller having an FPGA with one or more output channels. A bulk power supply is connected to each controller. One or more transistors are associated with each output channel. An electroplating chamber has one or more electrodes, with each electrode connected to at least one output channel. The system may include a waveform capture and viewing circuit providing built-in process verification and diagnostic tools. The system may also have a throttle back mode which attempts to maintain proper anode current ratios by reducing setpoints of all anodes by the same percentage, if a fault condition causes a reduction in current to one of the anodes. Blackbox logging may also optionally be used for recording selected data values into a circular buffer having a selected amount of memory.

Inventors: Cummings; Charles A. (Kalispell, MT), Borjesson; Mikael R. (Lakeside, MT)

Assignee: Applied Materials, Inc.

International Classification: C25B 9/04 (20060101); C25D 17/00 (20060101); C25D 21/12 (20060101)

Expiration Date: 1/19/12018