Patent Number: 8,657,413

Title: Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties

Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Inventors: Graham; David (Lexington, KY), Saldanha Singh; Jeanne Marie (Lexington, KY), Wells; Richard D. (Westerville, OH), Provence; Joel (Delaware, OH)

Assignee: Funai Electric Co., Ltd.

International Classification: B41J 2/01 (20060101); H01L 21/00 (20060101); C09J 183/10 (20060101); C09J 163/02 (20060101); C08G 59/50 (20060101); C08G 59/30 (20060101); C08G 59/24 (20060101)

Expiration Date: 2022-02-25 0:00:00