Patent Number: 8,713,957

Title: Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s)

Abstract: Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.

Inventors: Campbell; Levi A. (Poughkeepsie, NY), Chu; Richard C. (Hopewell Junction, NY), David; Milnes P. (Fishkill, NY), Ellsworth, Jr.; Michael J. (Lagrangeville, NY), Iyengar; Madhusudan K. (Foster City, CA), Simons; Robert E. (Poughkeepsie, NY)

Assignee: International Business Machines Corporation

International Classification: F25D 23/12 (20060101)

Expiration Date: 5/06/12018