Patent Number: 8,715,412

Title: Laser-irradiated thin films having variable thickness

Abstract: Systems for processing thin films having variable thickness are provided. A crystalline film includes a first crystalline region having a first film thickness and a first crystalline grain structure; and a second crystalline region having a second film thickness and a second crystalline grain structure. The first film thickness is greater than the second film thickness and the first and second film thicknesses are selected to provide a crystalline region having the degree and orientation of crystallization that is desired for a device component.

Inventors: Im; James S. (New York, NY)

Assignee: The Trustees of Columbia University in the City of New York

International Classification: C30B 1/00 (20060101); C30B 5/00 (20060101); C30B 28/02 (20060101); C30B 3/00 (20060101)

Expiration Date: 5/06/12018