Patent Number: 8,715,454

Title: Sealing film and a semiconductor device using the same

Abstract: A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 .mu.m at 80.degree. C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pas in a B-stage state at 50 to 100.degree. C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of -50 to 50.degree. C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 .mu.m, and (C) a colorant.

Inventors: Kawakami; Hiroyuki (Ichihara, JP), Niijima; Katsuyasu (Ichihara, JP), Tomori; Naoki (Ichihara, JP), Takemori; Daichi (Chiba, JP), Imai; Takuya (Ichihara, JP)

Assignee: Hitachi Chemical Company, Ltd.

International Classification: B29C 65/00 (20060101); B32B 38/10 (20060101); H01L 23/28 (20060101); B32B 37/00 (20060101); C09J 163/00 (20060101)

Expiration Date: 5/06/12018