Patent Number: 8,715,745

Title: Fungicidal compositions including hydrazone derivatives and copper

Abstract: The present invention relates to the use of hydrazone compounds and copper for controlling the growth of fungi.

Inventors: Young; David H (Carmel, IN), Shaber; Steven Howard (Zionsville, IN), Avila-Adame; Cruz (Carmel, IN), Breaux; Nneka T (Indianapolis, IN), Ruiz; James M (Westfield, IN), Siddall; Thomas L (Zionsville, IN), Webster; Jeffery D. (New Palestine, IN)

Assignee: Dow AgroSciences, LLC.

International Classification: A01N 33/26 (20060101)

Expiration Date: 5/06/12018