Patent Number: 8,716,405

Title: Resin composition, heat seal film and layered film

Abstract: The present invention provides a resin composition including (1) at least one selected from the group consisting of ethylene-.alpha.,.beta.-unsaturated carboxylic acid copolymers and ionomers thereof, which have a melt flow rate of from 0.5 g/10 min to 6 g/10 min, (2) at least one selected from the group consisting of ethylene-.alpha.,.beta.-unsaturated carboxylic acid copolymers and ionomers thereof, which have a melt flow rate of from 10 g/10 min to 30 g/10 min, and (3) at least one selected from the group consisting of propylene homopolymers and copolymers obtained by copolymerization using propylene and one or more .alpha.-olefins excluding propylene, in which a structural unit derived from an .alpha.,.beta.-unsaturated carboxylic acid ester is substantially not contained in the total amount of the ethylene-.alpha.,.beta.-unsaturated carboxylic acid copolymers and the ionomers thereof.

Inventors: Nakano; Shigenori (Ichihara, JP), Suzuki; Kaoru (Ichihara, JP)

Assignee: Du Pont-Mitsui Polychemicals Co. Ltd.

International Classification: C08F 8/00 (20060101); C08L 23/06 (20060101); C08L 23/10 (20060101); C08L 33/02 (20060101)

Expiration Date: 5/06/12018