Patent Number: 8,716,811

Title: Semiconductor device

Abstract: A semiconductor device includes a first conduction-type semiconductor substrate, a first semiconductor region of a first conduction-type formed on the semiconductor substrate, a second semiconductor region of a second conduction-type formed on a surface of the first semiconductor region, a third semiconductor region of the second conduction-type formed to be separated from the second semiconductor region on the surface of the first semiconductor region, a fourth semiconductor region of the second conduction-type formed to be separated from the second semiconductor region and the third semiconductor region on the surface of the first semiconductor region, and a first electrode connected to the second semiconductor region and the third semiconductor region.

Inventors: Mori; Hideki (Kanagawa, JP), Arai; Chihiro (Kanagawa, JP)

Assignee: Sony Corporation

International Classification: H01L 29/66 (20060101)

Expiration Date: 5/06/12018