Patent Number: 8,716,874

Title: Semiconductor device having metal posts non-overlapping with other devices and layout method of semiconductor device

Abstract: A semiconductor device that is resin-sealed in a wafer level after a rewiring layer forming process and a metal post forming process forming a metal post are performed on a semiconductor substrate of the semiconductor device includes devices formed on the semiconductor substrate. Further all of the devices are disposed in respective positions other than positions overlapping a peripheral border of the metal post when viewed from a top of the semiconductor substrate.

Inventors: Konishi; Junichi (Hyogo, JP), Ueda; Naohiro (Hyogo, JP)

Assignee: Ricoh Company, Ltd.

International Classification: H01L 29/40 (20060101)

Expiration Date: 5/06/12018