Patent Number: 8,717,118

Title: Transformer signal coupling for flip-chip integration

Abstract: Methods for transformer signal coupling and impedance matching for flip-chip circuit assemblies are presented. In one embodiment, a method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer. In another embodiment, a method for matching impedance in an RF circuit fabricated using flip-chip techniques may include passing an RF input signal through a first inductor formed using a passive process, inducing a time varying magnetic flux in proximity to a second inductor formed using an active process, and passing an RF signal induced by the time varying magnetic flux through the second inductor.

Inventors: Kim; Jonghae (San Diego, CA), Wang; Feng (San Diego, CA), Nowak; Matthew M. (San Diego, CA)

Assignee: QUALCOMM Incorporated

International Classification: H03H 7/38 (20060101)

Expiration Date: 5/06/12018