Patent Number: 8,718,787

Title: Wireless communication with a medical implant

Abstract: An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.

Inventors: Utsi; Vincent (Ely, GB), Norris; Mark (Cambridge, GB), Richerd; Jean-Daniel (Cambridge, GB)

Assignee: MicroCHIPS, Inc.

International Classification: A61N 1/02 (20060101)

Expiration Date: 5/06/12018