Patent Number: 8,720,045

Title: Apparatus for mounting components on a substrate

Abstract: A component mounting device which is provided with a transport unit which has a transport region and transports a substrate in the transport region; a plurality of supply regions which are lined up along the transport direction of the substrate due to the transport unit and are able to supply each component; a control unit which sets a mounting region which is a region where the component is mounted in the transport region of the transport unit according to the disposing of the supply region of the component which is necessary for the substrate out of the plurality of supply regions; and a mounting unit which takes out the component which is necessary for the substrate from at least one supply region out of the plurality of supply regions and performs mounting the component on the substrate in the mounting region which has been set.

Inventors: Nakamura; Takeshi (Saitama, JP)

Assignee: Sony Corporation

International Classification: H05K 13/04 (20060101)

Expiration Date: 5/13/12018