Patent Number: 8,720,048

Title: Method of manufacturing a printed circuit board

Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.

Inventors: Hwang; Mi Sun (Suwon, KR), Lee; Jae Joon (Suwon, KR), Kang; Myung Sam (Hwaseong, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: H05K 3/36 (20060101); H01K 3/10 (20060101)

Expiration Date: 5/13/12018