Patent Number: 8,720,049

Title: Printed circuit board and method for fabricating the same

Abstract: Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.

Inventors: Bae; Tae Kyun (Gyunggi-do, KR), Oh; Chang Gun (Gyunggi-do, KR), Park; Ho Sik (Gyunggi-do, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd

International Classification: H05K 3/20 (20060101)

Expiration Date: 5/13/12018