Patent Number: 8,720,531

Title: Electronic device cooling apparatus

Abstract: An electronic device cooling apparatus including a cooling device including a heat conductive plate formed with a flow path, a circulating pump, a liquid storage tank upper chamber and lower chamber provided on the upper and lower side of the heat conductive plate, and a bypass provided with the heat conductive plate so as to allow the cooling medium to pass through the liquid storage tank upper chamber and the liquid storage tank lower chamber.

Inventors: Ishida; Tomotaka (Tokyo, JP), Yamamoto; Mitsuru (Tokyo, JP), Kitajo; Sakae (Tokyo, JP), Taga; Kazuo (Oyama, JP), Kumakura; Kazuhiro (Oyama, JP)

Assignee: NEC Corporation

International Classification: F28D 15/00 (20060101); H05K 7/20 (20060101)

Expiration Date: 5/13/12018