Patent Number: 8,722,544

Title: Method of cleaning and micro-etching semiconductor wafers

Abstract: A method of simultaneously cleaning inorganic and organic contaminants from semiconductor wafers and micro-etching the semiconductor wafers. After the semiconductor wafers are cut or sliced from ingots, they are contaminated with cutting fluid as well as metal and metal oxides from the saws used in the cutting process. Aqueous alkaline cleaning and micro-etching solutions containing alkaline compounds and mid-range alkoxylates are used to simultaneously clean and micro-etch the semiconductor wafers.

Inventors: Barr; Robert K. (Shrewsbury, MA), Chan; Raymond (Westborough, MA)

Assignee: Rohm and Haas Electronic Materials LLC

International Classification: H01L 21/302 (20060101); C25F 3/00 (20060101); C11D 7/32 (20060101); H01L 21/461 (20060101)

Expiration Date: 5/13/12018