Patent Number: 8,791,558

Title: Stacked semiconductor package

Abstract: A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.

Inventors: Bae; Jin Ho (Icheon-si, KR), Kim; Ki Young (Seongnam-si, KR), Nam; Jong Hyun (Icheon-si, KR)

Assignee: SK Hynix Inc.

International Classification: H01L 23/02 (20060101); H01L 23/28 (20060101); H01L 23/52 (20060101); H01L 23/48 (20060101); H01L 29/40 (20060101)

Expiration Date: 7/29/12018