Patent Number: 8,792,044

Title: Image pickup device and method for manufacturing the image pickup device

Abstract: Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.

Inventors: Imai; Toshiyuki (Hachioji, JP), Teramoto; Tougo (Wakayama, JP), Iijima; Yasushi (Hachioji, JP), Hosoe; Shigeru (Hino, JP), Sato; Akira (Hachioji, JP), Fujii; Yuiti (Hachioji, JP), Watanabe; Daisuke (Niiza, JP)

Assignee: Konica Minolta Advanced Layers Inc.

International Classification: H04N 5/225 (20060101)

Expiration Date: 7/29/12018