Patent Number: 8,792,080

Title: Method and system to predict lithography focus error using simulated or measured topography

Abstract: A method and system to predict lithography focus error using chip topography data is disclosed. The chip topography data may be measured or simulated topography data. A plane is best fitted to the topography data, and residuals are computed. The residuals are then used to make a prediction regarding the focus error. The density ratio of metal to dielectric may also be used as a factor in determining the predicted focus error.

Inventors: Sapp; Brian Christopher (Hopewell Junction, NY), Cho; Choongyeun (Hopewell Junction, NY), Clevenger; Lawrence A. (Hopewell Junction, NY), Economikos; Laertis (Hopewell Junction, NY), Liegl; Bernhard R. (Hopewell Junction, NY), Petrarca; Kevin S. (Hopewell Junction, NY), Quon; Roger Allan (Hopewell Junction, NY)

Assignee: International Business Machines Corporation

International Classification: G03B 27/52 (20060101)

Expiration Date: 7/29/12018