Patent Number: 8,792,180

Title: Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die

Abstract: Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens (1) includes a first intermediate die production step using a die (7), a second intermediate die production step using the first intermediate die (8), and a wafer lens production step using the second intermediate die (9). A first intermediate-die substrate (80) is provided with a depressed section (85) on the surface facing the die (7). When photo-curable resin (84A) is pressed, at least a portion closer to the first intermediate-die substrate (80) among the top (71a) and the peripheral section (77) of the die (7) is arranged in the depressed section (85), and a gap is provided so that the die (7) does not contact with a depressed plane (85a) of the depressed section (85).

Inventors: Teramoto; Tougo (Wakayama, JP), Hosoe; Shigeru (Hino, JP), Sato; Akira (Hachioji, JP), Imai; Toshiyuki (Hachioji, JP), Fujii; Yuiti (Hachioji, JP)

Assignee: Konica Minolta Opto, Inc.

International Classification: G02B 3/00 (20060101)

Expiration Date: 7/29/12018