Patent Number: 8,792,239

Title: Power module package and method for manufacturing the same

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.

Inventors: Son; Jin Suk (Gyunggi-do, KR), Kim; Kwang Soo (Gyunggi-do, KR), Lee; Young Ki (Gyunggi-do, KR), Yun; Sun Woo (Gyunggi-do, KR), Park; Sung Keun (Gyunggi-do, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: H05K 7/20 (20060101)

Expiration Date: 7/29/12018