Patent Number: 8,792,318

Title: Method for high density data storage and imaging

Abstract: An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.

Inventors: Duerig; Urs T. (Rueschlikon, CH), Frommer; Jane Elizabeth (San Jose, CA), Gotsmann; Bernd Walter (Horgen, CH), Hagberg; Erik Christopher (Evansville, IN), Hedrick; James Lupton (Pleasanton, CA), Knoll; Armin W. (Zurich, CH), Lee; Victor Yee-Way (San Jose, CA), Magbitang; Teddie Peregrino (San Jose, CA), Miller; Robert Dennis (San Jose, CA), Pratt; Russell Clayton (Los Gatos, CA), Wade; Charles Gordon (Los Gatos, CA), Windeln; Johannes (Bodenheim, DE)

Assignee: International Business Machines Corporation

International Classification: G11B 3/00 (20060101); B29C 45/76 (20060101); G11B 9/00 (20060101)

Expiration Date: 7/29/12018