Patent Number: 8,792,755

Title: Light transmission path package, light transmission module, electronic device and method for manufacturing light transmission module

Abstract: A light transmission path package includes first and sealing surface adjustment members, which are arranged with facing each other by way of a light emitting/receiving element on a lead frame substrate, having a length in a normal direction of the substrate surface from the substrate surface of H2; wherein a relational expression H3<H2<H1 is satisfied where the height H1 is a distance in the normal line direction from the substrate surface to a surface of the light guide facing the substrate surface, and the height H3 is a length in the normal line direction from the substrate surface in the light emitting/receiving element. The sealing resin is filled so as to cover the first and second sealing surface adjustment members and so as not to come in contact with the light transmission path.

Inventors: Tanaka; Junichi (Nara, JP), Hosokawa; Hayami (Kyoto, JP), Yasuda; Naru (Uji, JP), Terakawa; Yukari (Kyoto, JP)

Assignee: OMRON Corporation

International Classification: G02B 6/02 (20060101); G02B 6/10 (20060101); G02B 6/122 (20060101); H01L 21/50 (20060101)

Expiration Date: 7/29/12018