Patent Number: 8,795,035

Title: Chemical mechanical planarization pad conditioner and method of forming

Abstract: A CMP pad conditioner including a substrate having a transparency window represented by an average internal transmittance of not less than about 90% over a wavelength range extending from about 400 nm to about 500 nm along a path length extending through the substrate of not less than about 10 mm a bonding layer overlying a surface of the substrate, and abrasive grains contained within the bonding layer.

Inventors: Wu; Jianhui (Westborough, MA), Querel; Gilles (Worcester, MA), Schulz; Eric (Worcester, MA), Hall; Richard W. J. (Southborough, MA)

Assignee: Saint-Gobain Abrasives, Inc.

International Classification: B24B 53/02 (20120101)

Expiration Date: 8/05/12018