Patent Number: 8,795,560

Title: Low thermal distortion silicone composite molds

Abstract: The present invention provides compositions and methods that may be used to form low thermal distortion molds. The composition may include a curable elastomeric silicone composition formed using a de-volatilized polymer and at least one de-volatilized cross-linker. One embodiment of the method may include forming a pattern on a first side of an elastomer that is impregnated with a fibrous material proximate a second side of the elastomer.

Inventors: Zhu; Bizhong (Midland, MI), Chen; Wei (Shanghai, CN)

Assignee: Dow Corning Corporation

International Classification: B29C 47/76 (20060101)

Expiration Date: 8/05/12018