Patent Number: 8,796,047

Title: Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip

Abstract: In one aspect, a method of enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging is disclosed. Also provided is an arrangement for implementing the inventive method. In another aspect, a method and on-chip controller are disclosed for enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging. Also provided is an on-chip reliability/variability controller arrangement for implementing the inventive method. In yet another aspect, base semiconductor chips, each comprising a plurality of chiplets, are manufactured and tested. For a base semiconductor chip having at least one non-functional chiplet, at least one repair semiconductor chiplet is vertically stacked. A functional multi-chip assembly is formed, which provides the same functionality as a base semiconductor chip in which all chiplets are functional.

Inventors: Bose; Pradip (Yorktown Heights, NY), Kursun; Eren (Ossining, NY), Rivers; Jude A. (Cortlandt Manor, NY), Zyuban; Victor (Yorktown Heights, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 25/00 (20060101)

Expiration Date: 8/05/12018