Patent Number: 8,796,820

Title: Semiconductor wafer and semiconductor device wafer

Abstract: A semiconductor wafer having a disc shape includes a chamfer provided around a circumferential edge of the wafer, and an anti-cracking and chipping groove provided in one or more areas around one circumference of an end face of the wafer along a circumferential direction of the end face. The anti-cracking and chipping groove is configured to prevent cracking or chipping of the end face in back grinding.

Inventors: Nemoto; Shusei (Hitachi, JP), Mashiyama; Hisashi (Hitachinaka, JP)

Assignee: Hitachi Metals, Ltd.

International Classification: H01L 29/06 (20060101)

Expiration Date: 8/05/12018